Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736076 | Multi-chip stacking of integrated circuit devices using partial device overlap | — | 2014-05-27 |
| 8627256 | Method for computing IO redistribution routing | — | 2014-01-07 |
| 8370777 | Method of generating a leadframe IC package model, a leadframe modeler and an IC design system | Stephen M. King, Jeffrey Klemovage, John J. Krantz, Allen S. Lim, Ashley Rebelo +1 more | 2013-02-05 |
| 7709861 | Systems and methods for supporting a subset of multiple interface types in a semiconductor device | Parag Madhani, Paul Barnes, Kandaswamy Prabakaran | 2010-05-04 |
| 7429703 | Methods and apparatus for integrated circuit device power distribution via internal wire bonds | Kerry L. Davison, Yehuda Smooha | 2008-09-30 |
| 7271485 | Systems and methods for distributing I/O in a semiconductor device | Parag Madhani, Paul Barnes, Kandaswamy Prabakaran | 2007-09-18 |
| 6790760 | Method of manufacturing an integrated circuit package | Charles Cohn | 2004-09-14 |
| 6476472 | Integrated circuit package with improved ESD protection for no-connect pins | Kerry L. Davison, Yehuda Smooha | 2002-11-05 |
| 6465882 | Integrated circuit package having partially exposed conductive layer | Charles Cohn | 2002-10-15 |