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Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material |
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Humeral implant for shoulder prosthesis |
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2008-11-04 |
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Flexible circuit substrate for flip-chip-on-flex applications |
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2008-07-01 |
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Musawir M. Chowdhury |
2007-01-02 |
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2004-09-14 |
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Method of manufacturing a printed wiring board having a discontinuous plating layer |
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2004-05-25 |
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2003-01-21 |
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Integrated circuit package having partially exposed conductive layer |
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2002-10-15 |
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Ball grid array plastic package |
George Addis Baxter, Theodore Joseph Sattler, Lakshmendra S. Saxena |
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Pin-fin heat sink |
Kevin J. Brady |
1994-03-29 |
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Plastic pin grid array package |
— |
1992-04-07 |
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Integrated circuit package using plastic encapsulant |
— |
1990-04-10 |