Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8601683 | Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material | Charles Cohn | 2013-12-10 |
| 8370777 | Method of generating a leadframe IC package model, a leadframe modeler and an IC design system | Donald E. Hawk, Stephen M. King, John J. Krantz, Allen S. Lim, Ashley Rebelo +1 more | 2013-02-05 |
| 7541220 | Integrated circuit device having flexible leadframe | Timothy Brooks Bambridge, Jeffery Gilbert, Juan Alejandro Herbsommer, George Libricz | 2009-06-02 |
| 7030472 | Integrated circuit device having flexible leadframe | Timothy Brooks Bambridge, Jeffery Gilbert, Juan Alejandro Herbsommer, George Libricz | 2006-04-18 |