Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8946871 | Thermal improvement of integrated circuit packages | Zeki Z. Celik, Allen S. Lim | 2015-02-03 |
| 7787252 | Preferentially cooled electronic device | — | 2010-08-31 |
| 7065721 | Optimized bond out method for flip chip wafers | Senol Pekin, Wilson Choi | 2006-06-20 |
| 6818996 | Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps | Senol Pekin | 2004-11-16 |
| 6114761 | Thermally-enhanced flip chip IC package with extruded heatspreader | Zeki Z. Celik, Farshad Ghahghahi, Zafer Kutlu | 2000-09-05 |
| 6069027 | Fixture for lid-attachment for encapsulated packages | Brent Bacher | 2000-05-30 |
| 6011304 | Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid | — | 2000-01-04 |
| 6008536 | Grid array device package including advanced heat transfer mechanisms | — | 1999-12-28 |
| 5977622 | Stiffener with slots for clip-on heat sink attachment | — | 1999-11-02 |
| 5940271 | Stiffener with integrated heat sink attachment | — | 1999-08-17 |
| 5909056 | High performance heat spreader for flip chip packages | — | 1999-06-01 |
| 5907189 | Conformal diamond coating for thermal improvement of electronic packages | — | 1999-05-25 |
| 5898571 | Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages | — | 1999-04-27 |
| 5866943 | System and method for forming a grid array device package employing electomagnetic shielding | — | 1999-02-02 |
| 5834839 | Preserving clearance between encapsulant and PCB for cavity-down single-tier package assembly | — | 1998-11-10 |