Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7102225 | Die-up ball grid array package with printed circuit board attachable heat spreader | Reza-ur Rahman Khan, Sam Ziqun Zhao | 2006-09-05 |
| 7038312 | Die-up ball grid array package with attached stiffener ring | Reza-ur Rahman Khan, Sam Zhao | 2006-05-02 |
| 6989593 | Die-up ball grid array package with patterned stiffener opening | Reza-ur Rahman Khan, Sam Ziqun Zhao | 2006-01-24 |
| 6126063 | Integrated circuit packaging apparatus and method | Sutee Vongfuangfoo, Minh Vuong | 2000-10-03 |
| 6069027 | Fixture for lid-attachment for encapsulated packages | Atila Mertol | 2000-05-30 |
| 5972738 | PBGA stiffener package | Sutee Vongfuangfoo, Felipe Sumagaysay | 1999-10-26 |