| 12182047 |
Chip-to-chip interface of a multi-chip module (MCM) |
Kameran Azadet, Ramani Tatikola, Edwin Thaller, Patrick Torta, Yu Wang +2 more |
2024-12-31 |
| 6897555 |
Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die |
Hong T. Lim, Chengyu Guo |
2005-05-24 |
| 6825554 |
PBGA electrical noise isolation of signal traces |
Aritharan Thurairajaratnam, Nadeem HAQUE |
2004-11-30 |
| 6687133 |
Ground plane on 2 layer PBGA |
Hong T. Lim, Chengyu Guo |
2004-02-03 |
| 6608376 |
Integrated circuit package substrate with high density routing mechanism |
Aritharan Thurairajaratnam, Maniam Alagaratnam |
2003-08-19 |
| 6566167 |
PBGA electrical noise isolation of signal traces |
Aritharan Thurairajaratnam, Nadeem HAQUE |
2003-05-20 |
| 6525421 |
Molded integrated circuit package |
Chok J. Chia, Seng-Sooi Lim |
2003-02-25 |
| 6512293 |
Mechanically interlocking ball grid array packages and method of making |
Chok J. Chia, Seng-Sooi Lim |
2003-01-28 |
