Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12182047 | Chip-to-chip interface of a multi-chip module (MCM) | Kameran Azadet, Ramani Tatikola, Edwin Thaller, Patrick Torta, Yu Wang +2 more | 2024-12-31 |
| 6897555 | Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die | Hong T. Lim, Chengyu Guo | 2005-05-24 |
| 6825554 | PBGA electrical noise isolation of signal traces | Aritharan Thurairajaratnam, Nadeem HAQUE | 2004-11-30 |
| 6687133 | Ground plane on 2 layer PBGA | Hong T. Lim, Chengyu Guo | 2004-02-03 |
| 6608376 | Integrated circuit package substrate with high density routing mechanism | Aritharan Thurairajaratnam, Maniam Alagaratnam | 2003-08-19 |
| 6566167 | PBGA electrical noise isolation of signal traces | Aritharan Thurairajaratnam, Nadeem HAQUE | 2003-05-20 |
| 6525421 | Molded integrated circuit package | Chok J. Chia, Seng-Sooi Lim | 2003-02-25 |
| 6512293 | Mechanically interlocking ball grid array packages and method of making | Chok J. Chia, Seng-Sooi Lim | 2003-01-28 |