Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8350379 | Package with power and ground through via | Qwai H. Low | 2013-01-08 |
| 7325216 | Method and computer program for spreading trace segments in an integrated circuit package design | — | 2008-01-29 |
| 6897555 | Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die | Hong T. Lim, Wee Liew | 2005-05-24 |
| 6687133 | Ground plane on 2 layer PBGA | Wee Liew, Hong T. Lim | 2004-02-03 |