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Packaged integrated device with memory buffer integrated circuit die and memory devices on module substrate |
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| 11742277 |
Packaged integrated device having memory buffer integrated circuit asymmetrically positioned on substrate |
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2023-08-29 |
| 10026666 |
Stacked die package with aligned active and passive through-silicon vias |
Wendemagegnehu Beyene, David A. Secker, Ely Tsern |
2018-07-17 |
| 6452262 |
Layout of Vdd and Vss balls in a four layer PBGA |
— |
2002-09-17 |
| 6406936 |
Method for increasing trace rows of a ball grid array |
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2002-06-18 |
| 6396140 |
Single reference plane plastic ball grid array package |
Aritharan Thurairajaratnam |
2002-05-28 |
| 6225690 |
Plastic ball grid array package with strip line configuration |
Aritharan Thurairajaratnam |
2001-05-01 |
| 6127728 |
Single reference plane plastic ball grid array package |
Aritharan Thurairajaratnam |
2000-10-03 |
