Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fluid handling system for wafer electroless plating and associated methods

Fluid handling system for wafer electroless plating and associated methods

US Patent 8844461 · Granted Sep 30, 2014

Estimated economic value: $8,350,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Compact high density plasma source2025
Compact high density plasma source2025
Atomic layer etch and deposition processing systems including a lens circuit wit2024
Zincating and doping of metal liner for liner passivation and adhesion improveme2024
Metal liner passivation and adhesion enhancement by zinc doping2022
Electrochemical doping of thin metal layers employing underpotential deposition 2022
Deposition apparatus including an isothermal processing zone2020
Metal liner passivation and adhesion enhancement by zinc doping2020
Selective electroless electrochemical atomic layer deposition in an aqueous solu2020
Layer-by-layer deposition using hydrogen2019
Electrochemical doping of thin metal layers employing underpotential deposition 2019
Self-forming barrier process2019