Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287110 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2016-03-15 |
| 8844461 | Fluid handling system for wafer electroless plating and associated methods | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2014-09-30 |
| 8485120 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2013-07-16 |
| 8314027 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2012-11-20 |
| 8221608 | Proximity processing using controlled batch volume with an integrated proximity head | Carl Woods, Yezdi Dordi, Robert A. Maraschin | 2012-07-17 |
| 8083207 | Apparatus for gate valve movement in a minimum-space wet process environment | Gregory A. Clemmer, Alan M. Schoepp | 2011-12-27 |
| 8069813 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2011-12-06 |
| 7811423 | Proximity processing using controlled batch volume with an integrated proximity head | Carl Woods, Yezdi Dordi, Robert A. Maraschin | 2010-10-12 |