Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9184333 | Contact and interconnect metallization for solar cells | Suketu Arun Parikh, James M. Gee | 2015-11-10 |
| 8293460 | Double exposure patterning with carbonaceous hardmask | Hui-Wan Chen, Chorng-Ping Chang, Yongmei Chen, Huixiong Dai, Jiahua Yu +7 more | 2012-10-23 |
| 8268728 | Method of cleaning and forming a negatively charged passivation layer over a doped region | Michael P. Stewart, Lisong Zhou, Li Xu | 2012-09-18 |
| 8084310 | Self-aligned multi-patterning for advanced critical dimension contacts | Bencherki Mebarki, Li Yan Miao, Christopher Dennis Bencher | 2011-12-27 |
| 8008208 | Method of cleaning and forming a negatively charged passivation layer over a doped region | Michael P. Stewart, Lisong Zhou, Li Xu | 2011-08-30 |
| 6632478 | Process for forming a low dielectric constant carbon-containing film | Frederic Gaillard, Li-Qun Xia, Ellie Yieh, Tian-Hoe Lim | 2003-10-14 |
| 6593615 | Dielectric gap fill process that effectively reduces capacitance between narrow metal lines using HDP-CVD | Michael E. Thomas | 2003-07-15 |
| 6576345 | Dielectric films with low dielectric constants | Patrick A. Van Cleemput, Ravi Laxman, Michelle T. Schulberg, Bunsen B. Nie | 2003-06-10 |
| 6383933 | Method of using organic material to enhance STI planarization or other planarization processes | Michael E. Thomas, Prochy Sethna | 2002-05-07 |
| 6348421 | Dielectric gap fill process that effectively reduces capacitance between narrow metal lines using HDP-CVD | Michael E. Thomas | 2002-02-19 |
| 6340628 | Method to deposit SiOCH films with dielectric constant below 3.0 | Patrick A. Van Cleemput, Ravi Laxman, Michelle T. Schulberg, Bunsen B. Nie | 2002-01-22 |