Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6770556 | Method of depositing a low dielectric with organo silane | David Cheung, Shin-Puu Jeng, Kuowei Liu, Yung-Cheng Yu | 2004-08-03 |
| 6743737 | Method of improving moisture resistance of low dielectric constant films | David Cheung, Nasreen Chopra, Yung-Cheng Lu, Robert P. Mandal, Farhad Moghadam | 2004-06-01 |
| 6734115 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2004-05-11 |
| 6730593 | Method of depositing a low K dielectric with organo silane | David Cheung, Shin-Puu Jeng, Kuowei Liu, Yung-Cheng Yu | 2004-05-04 |
| 6669858 | Integrated low k dielectrics and etch stops | Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Kuowei Liu +7 more | 2003-12-30 |
| 6660663 | Computer readable medium for holding a program for performing plasma-assisted CVD of low dielectric constant films formed from organosilane compounds | David Cheung, Robert R. Mandal | 2003-12-09 |
| 6660656 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2003-12-09 |
| 6649532 | Methods for etching an organic anti-reflective coating | Hui Chen, Xikun Wang, Hong Shih, Chun Yan | 2003-11-18 |
| 6632735 | Method of depositing low dielectric constant carbon doped silicon oxide | Ju-Hyung Lee, Nasreen Chopra, Tzu-Fang Huang, David Cheung, Farhad Moghadam +5 more | 2003-10-14 |
| 6627532 | Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Shin-Puu Jeng +2 more | 2003-09-30 |
| 6596655 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2003-07-22 |
| 6593247 | Method of depositing low k films using an oxidizing plasma | Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, David Cheung +5 more | 2003-07-15 |
| 6562690 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2003-05-13 |
| 6562544 | Method and apparatus for improving accuracy in photolithographic processing of substrates | David Cheung, Joe Feng, Judy H. Huang | 2003-05-13 |
| 6541282 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2003-04-01 |
| 6537929 | CVD plasma assisted low dielectric constant films | David Cheung, Robert R. Mandal | 2003-03-25 |
| 6511909 | Method of depositing a low K dielectric with organo silane | David Cheung, Shin-Puu Jeng, Kuowei Liu, Yung-Cheng Yu | 2003-01-28 |
| 6511903 | Method of depositing a low k dielectric with organo silane | David Cheung, Shin-Puu Jeng, Kuowei Liu, Yung-Cheng Yu | 2003-01-28 |
| 6448187 | Method of improving moisture resistance of low dielectric constant films | David Cheung, Nasreen Chopra, Yung-Cheng Lu, Robert P. Mandal, Farhad Moghadam | 2002-09-10 |
| 6413583 | Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound | Farhad Moghadam, David Cheung, Ellie Yieh, Li-Qun Xia, Chi-I Lang +4 more | 2002-07-02 |
| 6348725 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2002-02-19 |
| 6340435 | Integrated low K dielectrics and etch stops | Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Kuowei Liu +7 more | 2002-01-22 |
| 6324439 | Method and apparatus for applying films using reduced deposition rates | David Cheung, Joe Feng, Madhu Deshpande, Judy H. Huang | 2001-11-27 |
| 6303523 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2001-10-16 |
| 6287990 | CVD plasma assisted low dielectric constant films | David Cheung, Robert R. Mandal | 2001-09-11 |