Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610839 | Dummy fill structures | Tung-Hsing Lee, Teng-Yin Lin, Edward J. Gordon, Asmaa Elkadi, Alexander L. Martin +2 more | 2023-03-21 |
| 11362177 | Epitaxial semiconductor material regions for transistor devices and methods of forming same | Arkadiusz Malinowski, Baofu Zhu, Ali Razavieh, Julien Frougier | 2022-06-14 |
| 11205699 | Epitaxial semiconductor material regions for transistor devices and methods of forming same | Arkadiusz Malinowski, Baofu Zhu, Julien Frougier, Ali Razavieh | 2021-12-21 |
| 11088291 | Ultra-low reflectance broadband omni-directional anti-reflection coating | Sameer Chhajed, Jong Kyu Kim, Shawn-Yu Lin, Mei-Ling Kuo, David J. Poxson +2 more | 2021-08-10 |
| 10957588 | Chamferless via structures | Mark L. Lenhardt, Brown C. Peethala, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2021-03-23 |
| 10937694 | Chamferless via structures | Mark L. Lenhardt, Brown C. Peethala, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2021-03-02 |
| 10903118 | Chamferless via structures | Mark L. Lenhardt, Brown C. Peethala, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2021-01-26 |
| 10679937 | Devices and methods of forming low resistivity noble metal interconnect | Xunyuan Zhang, Errol Todd Ryan | 2020-06-09 |
| 10658176 | Methods of mitigating cobalt diffusion in contact structures and the resulting devices | Han You, Shariq Siddiqui, Brown C. Peethala | 2020-05-19 |
| 10636656 | Methods of protecting structure of integrated circuit from rework | Lei Sun, Xunyuan Zhang, Shao Beng Law | 2020-04-28 |
| 10636698 | Skip via structures | Xunyuan Zhang, Errol Todd Ryan | 2020-04-28 |
| 10388565 | Chamferless via structures | Mark L. Lenhardt, Brown C. Peethala, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2019-08-20 |
| 10283608 | Low resistance contacts to source or drain region of transistor | Xunyuan Zhang, Mark V. Raymond, Chengyu Niu | 2019-05-07 |
| 10262892 | Skip via structures | Xunyuan Zhang, Errol Todd Ryan | 2019-04-16 |
| 10157833 | Via and skip via structures | Xunyuan Zhang, Dongfei Pei | 2018-12-18 |
| 10062560 | Method of cleaning semiconductor device | Kevin J. Ryan, Shariq Siddiqui, Cornelius Brown Peethala | 2018-08-28 |
| 10056291 | Post spacer self-aligned cuts | Shao Beng Law, Xunyuan Zhang, Genevieve Beique, Lei Sun | 2018-08-21 |
| 10056292 | Self-aligned lithographic patterning | Shao Beng Law, Genevieve Beique, Lei Sun, Xunyuan Zhang | 2018-08-21 |
| 10032668 | Chamferless via structures | Mark L. Lenhardt, Brown C. Peethala, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2018-07-24 |
| 9947547 | Environmentally green process and composition for cobalt wet etch | Cornelius Brown Peethala, Shariq Siddiqui, Randolph F. Knarr | 2018-04-17 |
| 9831174 | Devices and methods of forming low resistivity noble metal interconnect | Xunyuan Zhang, Errol Todd Ryan | 2017-11-28 |
| 9831124 | Interconnect structures | Xunyuan Zhang | 2017-11-28 |
| 9799555 | Cobalt interconnects covered by a metal cap | Xunyuan Zhang | 2017-10-24 |
| 9799559 | Methods employing sacrificial barrier layer for protection of vias during trench formation | Shariq Siddiqui, Xunyuan Zhang, Brown C. Peethala, Douglas M. Trickett | 2017-10-24 |
| 9732427 | Tunable nanoporous films on polymer substrates, and method for their manufacture | David J. Poxson, E. Fred Schubert, Richard W. Siegel | 2017-08-15 |