Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495490 | Semiconductor device manufacturing method | Koichi Yatsuda, Tatsuya Yamaguchi, Frederic Lazzarino, Jean-Francois de Marneffe, Khashayar Babaei Gavan | 2022-11-08 |
| 11087973 | Method of selective deposition for BEOL dielectric etch | Doni Parnell | 2021-08-10 |
| 10910259 | Semiconductor device manufacturing method | Koichi Yatsuda, Tatsuya Yamaguchi, Frederic Lazzarino, Jean-Francois de Marneffe, Khashayar Babaei Gavan | 2021-02-02 |
| 9818610 | Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) | Hiroie Matsumoto, Andrew Metz, Katie Lutker-Lee | 2017-11-14 |
| 9768113 | Self aligned via in integrated circuit | Joe Lee, Lars Liebmann, Yann Mignot, Terry A. Spooner, Douglas M. Trickett +1 more | 2017-09-19 |
| 9607834 | Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) | Hiroie Matsumoto, Andrew Metz, Katie Lutker-Lee | 2017-03-28 |
| 9385078 | Self aligned via in integrated circuit | Joe Lee, Lars Liebmann, Yann Mignot, Terry A. Spooner, Douglas M. Trickett +1 more | 2016-07-05 |
| 9373582 | Self aligned via in integrated circuit | Joe Lee, Lars Liebmann, Yann Mignot, Terry A. Spooner, Douglas M. Trickett +1 more | 2016-06-21 |
| 8809185 | Dry etching method for metallization pattern profiling | — | 2014-08-19 |
| 8202803 | Method to remove capping layer of insulation dielectric in interconnect structures | Douglas M. Trickett | 2012-06-19 |
| 8080473 | Method for metallizing a pattern in a dielectric film | — | 2011-12-20 |
| 7947609 | Method for etching low-k material using an oxide hard mask | — | 2011-05-24 |
| 7935640 | Method for forming a damascene structure | — | 2011-05-03 |
| 7723237 | Method for selective removal of damaged multi-stack bilayer films | Sandra Hyland, Ian J. Brown | 2010-05-25 |
| 7637269 | Low damage method for ashing a substrate using CO2/CO-based process | Kelvin Zin, Masaru Nishino, Chong Hwan Chu | 2009-12-29 |