Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699973 | Semiconductor test structure and method for forming the same | Anthony K. Stamper, Jeffrey C. Stamm | 2020-06-30 |
| 10141274 | Semiconductor chip with anti-reverse engineering function | Edward C. Cooney, III, Fen Chen, Jonathan M. Pratt, Jason P. Ritter, Anna Tilley | 2018-11-27 |
| 10056306 | Test structure for monitoring interface delamination | Edward C. Cooney, III, Gary L. Milo, Thomas Warren Weeks, Jr., John C. S. Hall, Brian P. Conchieri +2 more | 2018-08-21 |
| 9893023 | Semiconductor chip with anti-reverse engineering function | Edward C. Cooney, III, Fen Chen, Jonathan M. Pratt, Jason P. Ritter, Anna Tilley | 2018-02-13 |
| 9711464 | Semiconductor chip with anti-reverse engineering function | Edward C. Cooney, III, Fen Chen, Jonathan M. Pratt, Jason P. Ritter, Anna Tilley | 2017-07-18 |
| 9553061 | Wiring bond pad structures | Donald R. Letourneau, Leah J. Bagley, John M. Sutton | 2017-01-24 |