Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8565510 | Methods for reading a feature pattern from a packaged die | John M. Cohn, John C. Malinowski, Karl V. Swanke | 2013-10-22 |
| 8299609 | Product chips and die with a feature pattern that contains information relating to the product chip | John M. Cohn, John C. Malinowski, Karl V. Swanke | 2012-10-30 |
| 8234597 | Tool and method to graphically correlate process and test data with specific chips on a wafer | Alexander Franz, Tyler D. Kieft, Raghav Kohli, Karl V. Swanke, Matthew S. Turnbull +1 more | 2012-07-31 |
| 8187897 | Fabricating product chips and die with a feature pattern that contains information relating to the product chip | John M. Cohn, John C. Malinowski, Karl V. Swanke | 2012-05-29 |