{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "IBM", "item": "https://www.patentleaderboard.com/company/ibm"}, {"@type": "ListItem", "position": 3, "name": "Steven R. Codding", "item": "https://www.patentleaderboard.com/inventor/fl:st_ln:codding-1"}]}
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Home › IBM › Steven R. Codding
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Steven R. Codding — 11 Patents

IBM: 11 patents #10,022 of 70,183Top 15%
Underhill Center, VT: #3 of 15 inventorsTop 20%
Vermont: #661 of 4,968 inventorsTop 15%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Steven R. Codding has been granted 11 US patents while listed as an inventor at IBM. The first was granted in 2006 and the most recent in October 2011. Steven R. Codding ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Steven R. Codding in Underhill Center, VT, US.

Patents per Year

Patents granted per year, 2006 to 2011Bar chart with a peak of 3 patents in 2010.peak 32006: 1 patents20062008: 2 patents20082009: 2 patents20092010: 3 patents20102011: 3 patents2011

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
8034718 Method to recover patterned semiconductor wafers for rework David Domina, James L. Hardy, Timothy C. Krywanczyk 2011-10-11 $5,277,000
7932614 Method of thinning a semiconductor substrate Timothy C. Krywanczyk, Timothy E. Neary, Edmund J. Sprogis 2011-04-26 $6,102,000
7867876 Method of thinning a semiconductor substrate Timothy C. Krywanczyk, Timothy E. Neary, Edmund J. Sprogis 2011-01-11 $2,856,000
7732303 Method for recycling of ion implantation monitor wafers Joseph R. Greco, Timothy C. Krywanczyk 2010-06-08 $3,517,000
7700488 Recycling of ion implantation monitor wafers Joseph R. Greco, Timothy C. Krywanczyk 2010-04-20 $4,962,000
7666689 Method to remove circuit patterns from a wafer David Domina, James L. Hardy, Timothy C. Krywanczyk 2010-02-23 $6,192,000
7572739 Tape removal in semiconductor structure fabrication Timothy C. Krywanczyk, Steven G. Perrotte, Jason P. Ritter 2009-08-11 $14,264,000
7498236 Silicon wafer thinning end point method Timothy C. Krywanczyk, Edmund J. Sprogis 2009-03-03 $5,705,000
7387911 Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking David M. Audette, Timothy C. Krywanczyk, Brian J. Thibault, Matthew R. Whalen 2008-06-17 $10,894,000
7348216 Rework process for removing residual UV adhesive from C4 wafer surfaces Timothy C. Krywanczyk, Edmund J. Sprogis, Jocelyn Sylvestre, Matthew R. Whalen 2008-03-25 $5,860,000
7025891 Method of polishing C4 molybdenum masks to remove molybdenum peaks Timothy C. Krywanczyk, Joseph Danaher, John C. Malinowski, James R. Palmer, Melvin T. Kelly +2 more 2006-04-11 $11,292,000

Frequent Collaborators

Timothy C. Krywanczyk11 shared
Edmund J. Sprogis4 shared
David Domina2 shared
James L. Hardy2 shared
Matthew R. Whalen2 shared
Joseph R. Greco2 shared

Nearby-Ranked Inventors

Ya-Ching Chang11
Hermann Lubbert11
Alexander WAITE11
Mehrad Mehr11
Matthew J. Purdey11
Nishtha Madaan11
Ian C. Richards11
Chad Huffman11
Lifeng Fan11