| 8034718 |
Method to recover patterned semiconductor wafers for rework |
David Domina, James L. Hardy, Timothy C. Krywanczyk |
2011-10-11 |
| 7932614 |
Method of thinning a semiconductor substrate |
Timothy C. Krywanczyk, Timothy E. Neary, Edmund J. Sprogis |
2011-04-26 |
| 7867876 |
Method of thinning a semiconductor substrate |
Timothy C. Krywanczyk, Timothy E. Neary, Edmund J. Sprogis |
2011-01-11 |
| 7732303 |
Method for recycling of ion implantation monitor wafers |
Joseph R. Greco, Timothy C. Krywanczyk |
2010-06-08 |
| 7700488 |
Recycling of ion implantation monitor wafers |
Joseph R. Greco, Timothy C. Krywanczyk |
2010-04-20 |
| 7666689 |
Method to remove circuit patterns from a wafer |
David Domina, James L. Hardy, Timothy C. Krywanczyk |
2010-02-23 |
| 7572739 |
Tape removal in semiconductor structure fabrication |
Timothy C. Krywanczyk, Steven G. Perrotte, Jason P. Ritter |
2009-08-11 |
| 7498236 |
Silicon wafer thinning end point method |
Timothy C. Krywanczyk, Edmund J. Sprogis |
2009-03-03 |
| 7387911 |
Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking |
David M. Audette, Timothy C. Krywanczyk, Brian J. Thibault, Matthew R. Whalen |
2008-06-17 |
| 7348216 |
Rework process for removing residual UV adhesive from C4 wafer surfaces |
Timothy C. Krywanczyk, Edmund J. Sprogis, Jocelyn Sylvestre, Matthew R. Whalen |
2008-03-25 |
| 7025891 |
Method of polishing C4 molybdenum masks to remove molybdenum peaks |
Timothy C. Krywanczyk, Joseph Danaher, John C. Malinowski, James R. Palmer, Melvin T. Kelly +2 more |
2006-04-11 |
