Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8034718 | Method to recover patterned semiconductor wafers for rework | David Domina, James L. Hardy, Timothy C. Krywanczyk | 2011-10-11 |
| 7932614 | Method of thinning a semiconductor substrate | Timothy C. Krywanczyk, Timothy E. Neary, Edmund J. Sprogis | 2011-04-26 |
| 7867876 | Method of thinning a semiconductor substrate | Timothy C. Krywanczyk, Timothy E. Neary, Edmund J. Sprogis | 2011-01-11 |
| 7732303 | Method for recycling of ion implantation monitor wafers | Joseph R. Greco, Timothy C. Krywanczyk | 2010-06-08 |
| 7700488 | Recycling of ion implantation monitor wafers | Joseph R. Greco, Timothy C. Krywanczyk | 2010-04-20 |
| 7666689 | Method to remove circuit patterns from a wafer | David Domina, James L. Hardy, Timothy C. Krywanczyk | 2010-02-23 |
| 7572739 | Tape removal in semiconductor structure fabrication | Timothy C. Krywanczyk, Steven G. Perrotte, Jason P. Ritter | 2009-08-11 |
| 7498236 | Silicon wafer thinning end point method | Timothy C. Krywanczyk, Edmund J. Sprogis | 2009-03-03 |
| 7387911 | Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking | David M. Audette, Timothy C. Krywanczyk, Brian J. Thibault, Matthew R. Whalen | 2008-06-17 |
| 7348216 | Rework process for removing residual UV adhesive from C4 wafer surfaces | Timothy C. Krywanczyk, Edmund J. Sprogis, Jocelyn Sylvestre, Matthew R. Whalen | 2008-03-25 |
| 7025891 | Method of polishing C4 molybdenum masks to remove molybdenum peaks | Timothy C. Krywanczyk, Joseph Danaher, John C. Malinowski, James R. Palmer, Melvin T. Kelly +2 more | 2006-04-11 |