Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7387911 | Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking | David M. Audette, Steven R. Codding, Timothy C. Krywanczyk, Matthew R. Whalen | 2008-06-17 |