Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8163602 | Ultraviolet energy curable tape and method of making a semiconductor chip using the tape | Timothy C. Krywanczyk, Donald W. Brouillette, Steven A. Martel | 2012-04-24 |
| 7902682 | Ultraviolet energy curable tape and method of making a semiconductor chip using the tape | Timothy C. Krywanczyk, Donald W. Brouillette, Steven A. Martel | 2011-03-08 |
| 7771560 | Methods to prevent ECC (edge chipping and cracking) damage during die picking process | James Ryan Johnson, Timothy C. Krywanczyk | 2010-08-10 |
| 7387911 | Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking | David M. Audette, Steven R. Codding, Timothy C. Krywanczyk, Brian J. Thibault | 2008-06-17 |
| 7348216 | Rework process for removing residual UV adhesive from C4 wafer surfaces | Steven R. Codding, Timothy C. Krywanczyk, Edmund J. Sprogis, Jocelyn Sylvestre | 2008-03-25 |
| 7288465 | Semiconductor wafer front side protection | Allan D. Abrams, Donald W. Brouillette, Joseph Danaher, Timothy C. Krywanczyk, Rene Lamothe +1 more | 2007-10-30 |
| 7001827 | Semiconductor wafer front side protection | Allan D. Abrams, Donald W. Brouillette, Joseph Danaher, Timothy C. Krywanczyk, Rene Lamothe +1 more | 2006-02-21 |