Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6323045 | Method and structure for top-to-bottom I/O nets repair in a thin film transfer and join process | Christopher Cline, Nancy Wagner Hannon, Chandrika Prasad, Thomas A. Wassick | 2001-11-27 |
| 6281452 | Multi-level thin-film electronic packaging structure and related method | Chandrika Prasad, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann +6 more | 2001-08-28 |
| 6248599 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly, Yeeling L. Lee +3 more | 2001-06-19 |
| 6235412 | Corrosion-resistant terminal metal pads for thin film packages | Tien-Jen Cheng, Ajay P. Giri, Ashwani K. Malhotra, John R. Pennacchia, Eric D. Perfecto | 2001-05-22 |
| 6183588 | Process for transferring a thin-film structure to a substrate | Kimberley A. Kelly, Ashwani K. Malhotra, Eric D. Perfecto | 2001-02-06 |
| 6149048 | Apparatus and method for use in manufacturing semiconductor devices | William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more | 2000-11-21 |
| 6143117 | Process for transferring a thin-film structure to a temporary carrier | Kimberley A. Kelly, Ashwani K. Malhotra, Eric D. Perfecto | 2000-11-07 |
| 6099935 | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices | William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more | 2000-08-08 |
| 6090633 | Multiple-plane pair thin-film structure and process of manufacture | Chandrika Prasad, John R. Pennacchia, Harvey C. Hamel | 2000-07-18 |
| 6083375 | Process for producing corrosion-resistant terminal metal pads for thin film packages | Tien-Jen Cheng, Ajay P. Giri, Ashwani K. Malhotra, John R. Pennacchia, Eric D. Perfecto | 2000-07-04 |
| 6054749 | Thin film device repaired using enhanced repair process | Gerald K. Bartley, Peter A. Franklin, Carmine J. Mele, Arthur G. Merryman, John R. Pennacchia +3 more | 2000-04-25 |
| 6048741 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly, Yeeling L. Lee +3 more | 2000-04-11 |
| 6036809 | Process for releasing a thin-film structure from a substrate | Kimberley A. Kelly, Ashwani K. Malhotra, Eric D. Perfecto | 2000-03-14 |
| 5972723 | Enhanced thin film wiring net repair process | Gerald K. Bartley, Peter A. Franklin, Carmine J. Mele, Arthur G. Merryman, John R. Pennacchia +3 more | 1999-10-26 |
| 5937269 | Graphics assisted manufacturing process for thin-film devices | Gerald K. Bartley, Peter A. Franklin, Carmine J. Mele, Arthur G. Merryman, John R. Pennacchia +3 more | 1999-08-10 |
| 5735452 | Ball grid array by partitioned lamination process | William Brearley, Kimberley A. Kelly, Patrick M. O'Leary, Arthur G. Merryman, James Wood | 1998-04-07 |
| 5722579 | Bottom-surface-metallurgy rework process in ceramic modules | James Wood, Thomas Michael Biruk, Gregory S. Boettcher, William Brearley, Kimberley A. Kelly +2 more | 1998-03-03 |