LH

Louis L. Hsu

IBM: 466 patents #26 of 70,183Top 1%
Infineon Technologies Ag: 9 patents #2,021 of 7,486Top 30%
SA Siemens Aktiengesellschaft: 3 patents #4,667 of 22,248Top 25%
IT ITRI: 2 patents #3,461 of 9,619Top 40%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
📍 Taipei, NY: #1 of 76 inventorsTop 2%
Overall (All Time): #439 of 4,157,543Top 1%
471
Patents All Time

Issued Patents All Time

Showing 51–75 of 471 patents

Patent #TitleCo-InventorsDate
7915682 Semiconductor FinFET structures with encapsulated gate electrodes and methods for forming such semiconductor FinFET structures Jack A. Mandelman 2011-03-29
7911263 Leakage current mitigation in a semiconductor device Jong-Ru Guo, Rajiv V. Joshi, Ping-Chuan Wang, Zhijian Yang 2011-03-22
7898014 Semiconductor device structures with self-aligned doped regions and methods for forming such semiconductor device structures Kangguo Cheng, Jack A. Mandelman 2011-03-01
7893529 Thermoelectric 3D cooling Ping-Chuan Wang, Xiaojin Wei, Huilong Zhu 2011-02-22
7888729 Flash memory gate structure for widened lithography window Kangguo Cheng, Lawrence A. Clevenger, Timothy J. Dalton 2011-02-15
7875960 Hybrid oriented substrates and crystal imprinting methods for forming such hybrid oriented substrates Jack A. Mandelman, William R. Tonti 2011-01-25
7873922 Structure for robust cable connectivity test receiver for high-speed data receiver Huihao Xu, Kevin G. Kramer, James D. Rockrohr, Michael A. Sorna 2011-01-18
7867820 Methods for forming co-planar wafer-scale chip packages Lloyd Burrell, Howard H. Chen, Wolfgang Sauter 2011-01-11
7868374 Semitubular metal-oxide-semiconductor field effect transistor Kangguo Cheng, Lawrence A. Clevenger, Timothy J. Dalton, Jack A. Mandelman 2011-01-11
7863960 Three-dimensional chip-stack synchronization Ping-Chuan Wang, Anthony R. Bonaccio, Jong-Ru Guo 2011-01-04
7855563 Robust cable connectivity test receiver for high-speed data receiver Huihao Xu, Kevin G. Kramer, James D. Rockrohr, Michael A. Sorna 2010-12-21
7851321 Semiconductor integrated circuit devices having high-Q wafer back-side capacitors Lawrence A. Clevenger, Timothy J. Dalton, Carl Radens, Vidhya Ramachandran, Keith Kwong Hon Wong +1 more 2010-12-14
7839163 Programmable through silicon via Kai D. Feng, Ping-Chuan Wang, Zhijian Yang 2010-11-23
7838873 Structure for stochastic integrated circuit personalization Lawrence A. Clevenger, Matthew E. Colburn, Timothy J. Dalton, Michael C. Gaidis, Carl Radens +2 more 2010-11-23
7840916 Structure for on-chip electromigration monitoring system Hayden C. Cranford, Jr., Oleg Gluschenkov, James S. Mason, Michael A. Sorna, Chih-Chao Yang 2010-11-23
7833873 Method and structure to reduce contact resistance on thin silicon-on-insulator device Brian J. Greene, Jack A. Mandelman, Chun-Yung Sung 2010-11-16
7825420 Method for forming slot via bitline for MRAM devices Michael C. Gaidis, Carl Radens, Lawrence A. Clevenger, Timothy J. Dalton, Keith Kwong Hon Wong +1 more 2010-11-02
7821330 Method and apparatus for extending the lifetime of a semiconductor chip Ping-Chuan Wang, Jong-Ru Guo, Zhijian Yang 2010-10-26
7816945 3D chip-stack with fuse-type through silicon via Kai D. Feng, Ping-Chuan Wang, Zhijian Yang 2010-10-19
7809340 Apparatus for implementing enhanced hand shake protocol in microelectronic communication systems Jack A. Mandelman, James S. Mason 2010-10-05
7803700 Crystal imprinting methods for fabricating substrates with thin active silicon layers Jack A. Mandelman, William R. Tonti 2010-09-28
7804148 Opto-thermal mask including aligned thermal dissipative layer, reflective layer and transparent capping layer Jack A. Mandelman, Chandrasekhar Narayan, Chun-Yung Sung 2010-09-28
7785934 Electronic fuses in semiconductor integrated circuits Jack A. Mandelman, William R. Tonti, Chih-Chao Yang 2010-08-31
7778351 Tunable CMOS receiver apparatus Li-Kong Wang, Philip J. Murfet 2010-08-17
7774660 Flexible row redundancy system Gregory J. Fredeman, Rajiv V. Joshi, Toshiaki Kirihata 2010-08-10