Issued Patents All Time
Showing 26–50 of 471 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8219040 | Transmitter bandwidth optimization circuit | Hayden C. Cranford, Jr., Joseph Natonio, James D. Rockrohr, Huihao Xu, Steven J. Zier | 2012-07-10 |
| 8219041 | Design structure for transmitter bandwidth optimization circuit | Hayden C. Cranford, Jr., Joseph Natonio, James D. Rockrohr, Huihao Xu, Steven J. Zier | 2012-07-10 |
| 8211756 | 3D chip-stack with fuse-type through silicon via | Kai D. Feng, Ping-Chuan Wang, Zhijian Yang | 2012-07-03 |
| 8188786 | Modularized three-dimensional capacitor array | Xu Ouyang, Chih-Chao Yang | 2012-05-29 |
| 8138603 | Redundancy design with electro-migration immunity | Conal E. Murray, Ping-Chuan Wang, Chih-Chao Yang | 2012-03-20 |
| 8129609 | Integrated thermoelectric cooling devices and methods for fabricating same | Howard H. Chen, Richard C. Chu | 2012-03-06 |
| 8115575 | Active inductor for ASIC application | Jong-Ru Guo, Ping-Chuan Wang, Zhijian Yang | 2012-02-14 |
| 8098536 | Self-repair integrated circuit and repair method | Rajiv V. Joshi, Zhijian Yang, Ping-Chuan Wang | 2012-01-17 |
| 8089285 | Implementing tamper resistant integrated circuit chips | David W. Kruger, James S. Mason, Richard W. Oldrey | 2012-01-03 |
| 8040813 | Apparatus and method for reduced loading of signal transmission elements | Karl D. Selander, Michael A. Sorna, Daniel W. Storaska | 2011-10-18 |
| 8030113 | Thermoelectric 3D cooling | Ping-Chuan Wang, Xiaojin Wei, Huilong Zhu | 2011-10-04 |
| 8024679 | Structure for apparatus for reduced loading of signal transmission elements | Karl D. Selander, Michael A. Sorna, Daniel W. Storaska | 2011-09-20 |
| 8024012 | Intelligent wireless power charging system | Lawrence A. Clevenger, Timothy J. Dalton, Carl Radens | 2011-09-20 |
| 8023305 | High density planar magnetic domain wall memory apparatus | Michael C. Gaidis, Lawrence A. Clevenger, Timothy J. Dalton, John K. DeBrosse, Carl Radens +2 more | 2011-09-20 |
| 8009453 | High density planar magnetic domain wall memory apparatus | Michael C. Gaidis, Lawrence A. Clevenger, Timothy J. Dalton, John K. DeBrosse, Carl Radens +2 more | 2011-08-30 |
| 8004097 | Carrier wafer having alignment keys and supporting a chip | Howard H. Chen | 2011-08-23 |
| 7994042 | Techniques for impeding reverse engineering | Rajiv V. Joshi, David W. Kruger | 2011-08-09 |
| 7984408 | Structures incorporating semiconductor device structures with reduced junction capacitance and drain induced barrier lowering | Kangguo Cheng, Jack A. Mandelman, Haining Yang | 2011-07-19 |
| 7984409 | Structures incorporating interconnect structures with improved electromigration resistance | Jack A. Mandelman, William R. Tonti, Chih-Chao Yang | 2011-07-19 |
| 7968949 | Contact forming method and related semiconductor device | Daniel C. Edelstein, Chih-Chao Yang | 2011-06-28 |
| 7956466 | Structure for interconnect structure containing various capping materials for electrical fuse and other related applications | William R. Tonti, Chih-Chao Yang | 2011-06-07 |
| 7948084 | Dielectric material with a reduced dielectric constant and methods of manufacturing the same | Jack A. Mandelman, Chih-Chao Yang | 2011-05-24 |
| 7947566 | Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate | Howard H. Chen, Jack A. Mandelman | 2011-05-24 |
| 7930664 | Programmable through silicon via | Kai D. Feng, Ping-Chuan Wang, Zhijian Yang | 2011-04-19 |
| 7923712 | Phase change memory element with a peripheral connection to a thin film electrode | John C. Arnold, Lawrence A. Clevenger, Timothy J. Dalton, Michael C. Gaidis, Carl Radens +2 more | 2011-04-12 |