Issued Patents All Time
Showing 51–70 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661097 | Ti liner for copper interconnect with low-k dielectric | Larry Clevenger, Stanley J. Klepeis, Hsiao-Ling Lu, Jeffrey R. Marino, Andrew H. Simon +2 more | 2003-12-09 |
| 6620657 | Method of forming a planar polymer transistor using substrate bonding techniques | Tricia Breen, Lawrence A. Clevenger, Louis L. Hsu, Li-Kong Wang | 2003-09-16 |
| 6539625 | Chromium adhesion layer for copper vias in low-k technology | Brett H. Engel, Mark Hoinkis, John A. Miller, Soon-Cheon Seo, Yun-Yu Wang | 2003-04-01 |
| 6528383 | Simultaneous formation of deep trench capacitor and resistor | Satya N. Chakravarti, Ashima B. Chakravarti, Irene McStay | 2003-03-04 |
| 6509265 | Process for manufacturing a contact barrier | Patrick W. DeHaven, Anthony G. Domenicucci, Lynne M. Gignac, Glen L. Miles, Prabhat Tiwari +2 more | 2003-01-21 |
| 6444516 | Semi-insulating diffusion barrier for low-resistivity gate conductors | Lawrence A. Clevenger, Jack A. Mandelman, Rajarao Jammy, Oleg Gluschenkov, Irene McStay +1 more | 2002-09-03 |
| 6436760 | Method for reducing surface oxide in polysilicon processing | Ashima B. Chakravarti, Satya N. Chakravarti, Subramanian S. Iyer | 2002-08-20 |
| 6432725 | Methods for crystallizing metallic oxide dielectric films at low temperature | Jingyu Lian, Katherine L. Saenger, Chenting Lin | 2002-08-13 |
| 6417567 | Flat interface for a metal-silicon contract barrier film | Anthony G. Domenicucci, Lynne M. Gignac, Yun-Yu Wang, Horatio S. Wildman, Roy A. Carruthers +2 more | 2002-07-09 |
| 6399490 | Highly conformal titanium nitride deposition process for high aspect ratio structures | Rajarao Jammy, Cheryl G. Faltermeier, Uwe Schroeder | 2002-06-04 |
| 6388327 | Capping layer for improved silicide formation in narrow semiconductor structures | Kenneth J. Giewont, Stephen Bruce Brodsky, Cyril Cabral, Jr., Anthony G. Domenicucci, Craig Ransom +2 more | 2002-05-14 |
| 6387790 | Conversion of amorphous layer produced during IMP Ti deposition | Anthony G. Domenicucci, Chung-Ping Eng, William J. Murphy, Tina Wagner, Yun-Yu Wang | 2002-05-14 |
| 6383929 | Copper vias in low-k technology | Steven H. Boettcher, Herbert L. Ho, Mark Hoinkis, Hyun Koo Lee, Yun-Yu Wang | 2002-05-07 |
| 6180521 | Process for manufacturing a contact barrier | Patrick W. DeHaven, Anthony G. Domenicucci, Lynne M. Gignac, Glen L. Miles, Prabhat Tiwari +2 more | 2001-01-30 |
| 6124639 | Flat interface for a metal-silicon contact barrier film | Anthony G. Domenicucci, Lynne M. Gignac, Yun-Yu Wang, Horatio S. Wildman | 2000-09-26 |
| 6022801 | Method for forming an atomically flat interface for a highly disordered metal-silicon barrier film | Anthony G. Domenicucci, Lynne M. Gignac, Yun-Yu Wang, Horatio S. Wildman | 2000-02-08 |
| 5534466 | Method of making area direct transfer multilayer thin film structure | Eric D. Perfecto, Chandrika Prasad, George E. White | 1996-07-09 |
| 5516412 | Vertical paddle plating cell | Panayotis Andricacos, Kirk G. Berridge, John O. Dukovic, Matteo Flotta, Jose Ordonez +5 more | 1996-05-14 |
| 5458520 | Method for producing planar field emission structure | Thomas A. DeMercurio, Roy R. Yu | 1995-10-17 |
| 5209817 | Selective plating method for forming integral via and wiring layers | Umar M. Ahmad, Daniel G. Berger, Ananda H. Kumar, Susan J. LaMaire, Keshav Prasad +1 more | 1993-05-11 |