CE

Chung-Ping Eng

IBM: 5 patents #18,733 of 70,183Top 30%
Overall (All Time): #1,030,128 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7372158 HDP-based ILD capping layer Yun-Yu Wang, Richard A. Conti, Matthew Nicholls 2008-05-13
7138717 HDP-based ILD capping layer Yun-Yu Wang, Richard A. Conti, Matthew Nicholls 2006-11-21
7008803 Method of reworking structures incorporating low-k dielectric materials Terence L. Kane, Brett H. Engel, Barry Ginsberg, Dermott MacPherson, John Charles Petrus 2006-03-07
6436823 Method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure and structure formed Cyril Cabral, Jr., Lynne M. Gignac, Christian Lavoie, Patricia A. O'Neil, Kirk D. Peterson +3 more 2002-08-20
6387790 Conversion of amorphous layer produced during IMP Ti deposition Anthony G. Domenicucci, William J. Murphy, Tina Wagner, Yun-Yu Wang, Kwong Hon Wong 2002-05-14