Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7544305 | Chemical mechanical polishing process for forming shallow trench isolation structure | Chia-Jung Hsu, Art Yu, Teng-Chun Tsai | 2009-06-09 |
| 7294575 | Chemical mechanical polishing process for forming shallow trench isolation structure | Chia-Rung Hsu, Art Yu, Teng-Chun Tsai | 2007-11-13 |
| 6913978 | Method for forming shallow trench isolation structure | Neng-Kuo Chen, Hsiu-Chuan Chu, Chih-An Huang, Teng-Chun Tsai | 2005-07-05 |
| 6661097 | Ti liner for copper interconnect with low-k dielectric | Larry Clevenger, Stanley J. Klepeis, Jeffrey R. Marino, Andrew H. Simon, Yun-Yu Wang +2 more | 2003-12-09 |
| 6251779 | Method of forming a self-aligned silicide on a semiconductor wafer | Li-Yeat Chen, Wen-Yi Hsieh | 2001-06-26 |
| 6249138 | Method for testing leakage current caused self-aligned silicide | Michael W C Huang, Gwo-Shii Yang, Wen-Yi Hsieh | 2001-06-19 |
| 6235606 | Method of fabricating shallow trench isolation | Michael W C Huang, Kuo-Tai Huang, Tri-Rung Yew | 2001-05-22 |
| 6140192 | Method for fabricating semiconductor device | Michael Huang, Tri-Rung Yew | 2000-10-31 |