Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6326696 | Electronic package with interconnected chips | Raymond R. Horton, Alphonso P. Lanzetta, Joseph M. Milewski, Lawrence S. Mok, Robert K. Montoye | 2001-12-04 |
| 6306686 | Method of fabricating an electronic package with interconnected chips | Raymond R. Horton, Alphonso P. Lanzetta, Joseph M. Milewski, Lawrence S. Mok, Robert K. Montoye | 2001-10-23 |