Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5734196 | Electronic packaging shaped beam lead fabrication | Alphonso P. Lanzetta, Ismail Gevdet Noyan, Michael J. Palmer | 1998-03-31 |
| 5687078 | Fine pitch bonding | Chandrasekhar Narayan, Michael J. Palmer | 1997-11-11 |
| 5675884 | Apparatus for multilayer conductor chip packaging | Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer | 1997-10-14 |
| 5676301 | Castellated nozzle and method of use thereof | Bernie Hernandez, Michael J. Palmer, Frederick G. Weindelmayer | 1997-10-14 |
| 5669437 | High efficiency thermal interposer | Bernardo Hernandez, Ismail C. Noyan, Michael J. Palmer | 1997-09-23 |
| 5641114 | Controlled temperature bonding | Chandrasekhar Narayan, Michael J. Palmer | 1997-06-24 |
| 5593083 | Castellated nozzle and method of use therof | Bernie Hernandez, Michael J. Palmer, Frederick G. Weindelmayer | 1997-01-14 |
| 5446261 | Solder application system using helix to control solder meniscus | Bernardo Hernandez, Michael J. Palmer, Ismail C. Noyan, Frederick G. Weindelmayer | 1995-08-29 |
| 5322204 | Electronic substrate multiple location conductor attachment technology | Mark F. Bregman, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong | 1994-06-21 |
| 5263620 | Wirebond removal apparatus using alternating fluid stream | Bernardo Hernandez, Ismail C. Noyan, Michael J. Palmer, Mark B. Ritter | 1993-11-23 |
| 5233221 | Electronic substrate multiple location conductor attachment technology | Mark F. Bregman, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong | 1993-08-03 |
| 5229328 | Method for bonding dielectric mounted conductors to semiconductor chip contact pads | Mark F. Bregman, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong | 1993-07-20 |
| 5205461 | Method and apparatus for fluxless solder bonding | Harry R. Bickford, Ismail C. Noyan, Michael J. Palmer, John C. Zyzo | 1993-04-27 |
| 5186632 | Electronic device elastomeric mounting and interconnection technology | Ismail C. Noyan, Michael J. Palmer, Mark B. Ritter | 1993-02-16 |
| 5117275 | Electronic substrate multiple location conductor attachment technology | Mark F. Bregman, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong | 1992-05-26 |
| 5074969 | Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate | William D. Brewer, Kurt R. Grebe, Linda C. Matthew, Ismail C. Noyan, Michael J. Palmer +2 more | 1991-12-24 |
| 5052606 | Tape automated bonding feeder | Thomas M. Cipolla, Alphonso P. Lanzetta, Michael J. Palmer, Mark B. Ritter | 1991-10-01 |
| 5038195 | Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate | William D. Brewer, Kurt R. Grebe, Linda C. Matthew, Ismail C. Noyan, Michael J. Palmer +2 more | 1991-08-06 |
| 5006925 | Three dimensional microelectric packaging | Mark F. Bregman, Ismail C. Noyan, Michael J. Palmer | 1991-04-09 |
| 4937006 | Method and apparatus for fluxless solder bonding | Harry R. Bickford, Ismail C. Novan, Michael J. Palmer, John C. Zyzo | 1990-06-26 |
| 4875614 | Alignment device | Thomas M. Cipolla, Philip Murphy, Michael J. Palmer | 1989-10-24 |