Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816390 | System and method for an electronic package with a fail-open mechanism | Carlo Marbella, Ganesh Vetrivel Periasamy, Kok Kiat Koo | 2014-08-26 |
| 7994608 | Magnetically alignable integrated circuit device | Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim | 2011-08-09 |
| 7768137 | Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip | Gerald Ofner, Mary Teo | 2010-08-03 |
| 6351032 | Method and structure for heatspreader attachment in high thermal performance IC packages | Bernard K H Lee, Ben T C Tan, Emillo F. Mallare, Jr., Sarvotham Bhandarkar, Subodh Mhaisalkar | 2002-02-26 |