Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10538540 | Perovskite core-shell nanocrystals | Tze Chien Sum, Weiqiang Chen, Nripan MATHEWS, Sjoerd Antonius Veldhuis, Saikat Bhaumik | 2020-01-21 |
| 9966726 | Emission source and method of forming the same | Guichuan Xing, Nripan MATHEWS, Tze Chien Sum | 2018-05-08 |
| 9899793 | Emission source and method of forming the same | Guichuan Xing, Nripan MATHEWS, Tze Chien Sum | 2018-02-20 |
| 9754727 | Energy charge storage device using a printable polyelectrolyte as electrolyte material | Tsyh Ying Grace Wee, Martti Kaempgen, Madhavi Srinivasan, Andrew Grimsdale, Yin Chiang Freddy Boey | 2017-09-05 |
| 9660310 | Electrode materials for metal-air batteries, fuel cells and supercapacitors | Wai Fatt Mak, Ting-Chih Wang, Nopphawan Phonthammachai, Madhavi Srinivasan, Yin Chiang Freddy Boey | 2017-05-23 |
| 9478835 | Integrated electrode architectures for energy generation and storage | Wai Fatt Mak, Tsyh Ying Grace Wee, Teddy Salim, Madhavi Srinivasan, Yin Chiang Freddy Boey | 2016-10-25 |
| 9096431 | Nanoparticle decorated nanostructured material as electrode material and method for obtaining the same | Tsyh Ying Grace Wee, Nopphawan Phonthammachai, Madhavi Srinivasan, Yin Chiang Freddy Boey | 2015-08-04 |
| 8486824 | Enhancing metal/low-K interconnect reliability using a protection layer | Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou +2 more | 2013-07-16 |
| 8445889 | Method of patterning of nanostructures | Kumar Bhupendra, Yuanyuan Zhang, Zongbin Wang, Lain-Jong Li | 2013-05-21 |
| 8329915 | Thienothiophene derivatives | Omer E. Ahmed Moawia, Ashok Kumar Mishra, Andrew Grimsdale, Siu Choon Ng, Beng S. Ong +1 more | 2012-12-11 |
| 8217518 | Enhancing metal/low-K interconnect reliability using a protection layer | Tong Yan Tee, Xueren Zhang, Shanzhong Wang, Valeriy Nosik, Jijie Zhou +2 more | 2012-07-10 |
| 7477362 | Moiré interferometric strain sensor | Anand Krishna Asundi, Anish Priyadarshi | 2009-01-13 |
| 6351032 | Method and structure for heatspreader attachment in high thermal performance IC packages | Bernard K H Lee, Ben T C Tan, Emillo F. Mallare, Jr., Sarvotham Bhandarkar, Ai Min Tan | 2002-02-26 |