Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8357565 | Integrated circuit package and a method for forming an integrated circuit package | Gerald Ofner, Swain Hong Yeo, Pei Siang Lim, Khoon Lam Chua | 2013-01-22 |
| 7994608 | Magnetically alignable integrated circuit device | Ai Min Tan, Gerald Ofner, Swain Hong Yeo, Pei Siang Lim | 2011-08-09 |
| 7768137 | Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip | Gerald Ofner, Ai Min Tan | 2010-08-03 |