Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861828 | Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof | Hui Teng Wang | 2020-12-08 |
| 10418343 | Package-in-package structure for semiconductor devices and methods of manufacture | Hui Teng Wang | 2019-09-17 |
| 8357565 | Integrated circuit package and a method for forming an integrated circuit package | Gerald Ofner, Mary Teo, Pei Siang Lim, Khoon Lam Chua | 2013-01-22 |
| 7994608 | Magnetically alignable integrated circuit device | Ai Min Tan, Gerald Ofner, Mary Teo, Pei Siang Lim | 2011-08-09 |