Issued Patents All Time
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177220 | Vertical and lateral interconnects between dies | Andreas Wolter, Bernd Waidhas, Thomas Wagner | 2021-11-16 |
| 11145577 | Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus | Sonja Koller, Reinhard Mahnkopf, Bernd Waidhas | 2021-10-12 |
| 11134573 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Sonja Koller, Bernd Waidhas | 2021-09-28 |
| 11127813 | Semiconductor inductors | Bernd Waidhas, Thomas Wagner, Andreas Wolter, Andreas Augustin | 2021-09-21 |
| 11107763 | Interconnect structure for stacked die in a microelectronic device | Thomas Wagner, Andreas Wolter | 2021-08-31 |
| 11081541 | Method of providing partial electrical shielding | Veronica Sciriha | 2021-08-03 |
| 11031699 | Antenna with graded dielectirc and method of making the same | Saravana Maruthamuthu, Bernd Waidhas, Andreas Augustin | 2021-06-08 |
| 11018114 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Bernd Waidhas, Andreas Augustin, Laurent Millou, Andreas Wolter, Reinhard Mahnkopf +2 more | 2021-05-25 |
| 10854590 | Semiconductor die package with more than one hanging die | Sven Albers, Klaus Reingruber, Richard Patten, Christian Geissler | 2020-12-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes, Klaus Reingruber +2 more | 2020-10-27 |
| 10727197 | Embedded-bridge substrate connectors and methods of assembling same | Bernd Waidhas, Andreas Wolter, Thomas Wagner, Stephan Stoeckl, Laurent Millou | 2020-07-28 |
| 10714455 | Integrated circuit package assemblies including a chip recess | Klaus Reingruber | 2020-07-14 |
| 10700159 | Method of providing partial electrical shielding | Veronica Sciriha | 2020-06-30 |
| 10672731 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Christian Geissler, Richard Patten | 2020-06-02 |
| 10658201 | Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device | Sonja Koller, Bernd Waidhas | 2020-05-19 |
| 10651102 | Interposer with conductive routing exposed on sidewalls | Klaus Reingruber, Christian Geissler, Sonja Koller | 2020-05-12 |
| 10629731 | Power mesh-on-die trace bumping | Bernd Waidhas, Sonja Koller | 2020-04-21 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Bernd Waidhas, Thomas Wagner +1 more | 2020-02-04 |
| 10546826 | Device containing and method of providing carbon covered copper layer | — | 2020-01-28 |
| 10522485 | Electrical device and a method for forming an electrical device | Christian Geissler, Sven Albers, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more | 2019-12-31 |
| 10522454 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Gerald Ofner, Andreas Wolter, Sven Albers, Christian Geissler | 2019-12-31 |
| 10490527 | Vertical wire connections for integrated circuit package | Christian Geissler, Sven Albers, Andreas Wolter, Klaus Reingruber, Thomas Wagner +1 more | 2019-11-26 |
| 10446541 | Advanced node cost reduction by ESD interposer | Christian Geissler, Klaus Reingruber | 2019-10-15 |
| 10431545 | Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same | Bernd Waidhas, Thomas Wagner, Andreas Wolter, Laurent Millou | 2019-10-01 |
| 10411000 | Microelectronic package with illuminated backside exterior | Marc Dittes, Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber +2 more | 2019-09-10 |