Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381127 | Semiconductor chip device integrating thermal pipes in three-dimensional packaging | Rahul Agarwal | 2025-08-05 |
| 12374645 | Electronic device including dies and an interconnect coupled to the dies and processes of forming the same | Lei Fu, Brett P. Wilkerson | 2025-07-29 |
| 12278150 | Semiconductor package with annular package lid structure | Priyal Shah, Brett P. Wilkerson | 2025-04-15 |
| 12276850 | Fanout module integrating a photonic integrated circuit | Brett P. Wilkerson, Kong-Toon Ng, Rahul Agarwal | 2025-04-15 |
| 12266611 | Mixed density interconnect architectures using hybrid fan-out | Rahul Agarwal, Brett P. Wilkerson | 2025-04-01 |
| 12165981 | 3D semiconductor package with die-mounted voltage regulator | Gabriel H. Loh, Rahul Agarwal, Brett P. Wilkerson | 2024-12-10 |
| 11911839 | Low temperature hybrid bonding | Priyal Shah, Rahul Agarwal, Brett P. Wilkerson | 2024-02-27 |
| 11830817 | Creating interconnects between dies using a cross-over die and through-die vias | Rahul Agarwal, Michael Alfano, Gabriel H. Loh, Alan D. Smith, Gabriel Wong +1 more | 2023-11-28 |
| 11709327 | Fanout module integrating a photonic integrated circuit | Brett P. Wilkerson, Kong-Toon Ng, Rahul Agarwal | 2023-07-25 |