| 6857790 |
Apparatus and method to vertically route and connect multiple optical fibers |
Mohammad Khan |
2005-02-22 |
| 6538307 |
Packaging substrate comprising staggered vias |
Viswanath Valluri, Melissa Lee |
2003-03-25 |
| 6515354 |
Micro-BGA beam lead connection with cantilevered beam leads |
Viswanath Valluri, Valerie Vivares |
2003-02-04 |
| 6507100 |
Cu-balanced substrate |
Viswanath Valluri, Melissa Lee |
2003-01-14 |
| 6448507 |
Solder mask for controlling resin bleed |
Viswanath Valluri, Donald Bottarini |
2002-09-10 |
| 6432291 |
Simultaneous electroplating of both sides of a dual-sided substrate |
Valerie Vivares, Robert A. Newman |
2002-08-13 |
| 6426290 |
Electroplating both sides of a workpiece |
Valerie Vivares, Robert A. Newman |
2002-07-30 |
| 6348142 |
Electroplating multi-trace circuit board substrates using single tie bar |
Valerie Vivares |
2002-02-19 |