Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6538307 | Packaging substrate comprising staggered vias | Edwin Fontecha, Melissa Lee | 2003-03-25 |
| 6515354 | Micro-BGA beam lead connection with cantilevered beam leads | Edwin Fontecha, Valerie Vivares | 2003-02-04 |
| 6507100 | Cu-balanced substrate | Edwin Fontecha, Melissa Lee | 2003-01-14 |
| 6465745 | Micro-BGA beam lead connection | Edwin R. Fontacha | 2002-10-15 |
| 6448507 | Solder mask for controlling resin bleed | Edwin Fontecha, Donald Bottarini | 2002-09-10 |