Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package lid with a wetting film

Integrated circuit package lid with a wetting film

US Patent 7633151 · Granted Dec 15, 2009

Estimated economic value: $19,433,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Composite membrane with multi-layered active layer2019
Composite membrane with multi-layered active layer2017
Thin film composite membranes embedded with molecular cage compounds2016
Metal alloy injection molding2015
Metal alloy injection molding overflows2015
Metal alloy injection molding protrusions2015
Thin film composite membranes embedded with molecular cage compounds2014
Lid attach process2014
Metal alloy injection molding protrusions2014
Filtration membrane with covalently grafted fouling-resistant polymer2013
Lid attach process2013
Semiconductor chip with a rounded corner2013