Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Temporary interconnect for semiconductor devices

Temporary interconnect for semiconductor devices

US Patent 6208027 · Granted Mar 27, 2001

Estimated economic value: $5,495,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit socket2012
Circuit board with notched stiffener frame2012
Semiconductor chip with solder joint protection ring2011
Integrated circuit package lid with a wetting film2009
Reduction of damage to thermal interface material due to asymmetrical load2009
Method of integrated circuit packaging2009
Method of forming a stack of packaged memory dice2006
Semiconductor chip package2006
Plastic lead frames for semiconductor devices and packages including same2006
Plastic lead frames for semiconductor devices2005
Multichip semiconductor package2005
Apparatus for forming a stack of packaged memory dice2005