Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6409070 | Minimizing flux residue by controlling amount of moisture during reflow | Mohammad Khan, Maria Guardado, Diong Hing Ding, Junaida A. Bakar | 2002-06-25 |
| 6382500 | Solder reflow furnace with flux effluent collector and method of preventing flux contamination | Mohammad Khan, Maria Guardado, Sp Lee, Sofi Mohd | 2002-05-07 |
| 6372544 | Method to reduce occurrences of fillet cracking in flip-chip underfill | Jonathan D. Halderman | 2002-04-16 |
| 6371310 | Boat for land grid array packages | Mohammad Khan, L. K. Teoh | 2002-04-16 |
| 6367679 | Detection of flux residue | Jonathan D. Halderman | 2002-04-09 |
| 6333253 | Pattern-block flux deposition | Terri J. Brownfield | 2001-12-25 |
| 6333210 | Process of ensuring detect free placement by solder coating on package pads | Ajit M. Dubey | 2001-12-25 |
| 6258612 | Determination of flux prior to package assembly | Jonathan D. Halderman | 2001-07-10 |
| 6229207 | Organic pin grid array flip chip carrier package | — | 2001-05-08 |
| 6103549 | No clean flux for flip chip assembly | Orion K. Starr, Maria Guardado, Mohammad Khan | 2000-08-15 |
| 6098867 | Automated brush fluxing system for application of controlled amount of flux to packages | Maria Guardado, Mohammad Khan | 2000-08-08 |
| 5988485 | Flux cleaning for flip chip technology using environmentally friendly solvents | Orion K. Starr, Mohammad Khan | 1999-11-23 |
| 5779133 | In-situ device removal for multi-chip modules | Raymond A. Jackson, Kathleen A. Lidestri, David C. Linnell | 1998-07-14 |
| 5605277 | Hot vacuum device removal process and apparatus | Raymond A. Jackson, Kathleen A. Lidestri, William E. Sablinski, David C. Linnell | 1997-02-25 |
| 5553766 | In-situ device removal for multi-chip modules | Raymond A. Jackson, Kathleen A. Lidestri, David C. Linnell | 1996-09-10 |
| 5543584 | Structure for repairing electrical lines | Edward F. Handford, Joseph M. Harvilchuck, Mario J. Interrante, Raymond A. Jackson, Sudipta K. Ray +2 more | 1996-08-06 |
| 5167913 | Method of forming an adherent layer of metallurgy on a ceramic substrate | John Acocella, Philip L. Flaitz, Chandrasekhar Narayan, Sarah H. Knickerbocker, Paul H. Palmateer +2 more | 1992-12-01 |
| 5153408 | Method and structure for repairing electrical lines | Edward F. Handford, Joseph M. Harvilchuck, Mario J. Interrante, Raymond A. Jackson, Sudipta K. Ray +2 more | 1992-10-06 |
| 4885038 | Method of making multilayered ceramic structures having an internal distribution of copper-based conductors | Herbert R. Anderson, Jr., Renuka S. Divakaruni, Joseph M. Dynys, Steven M. Kandetzke, Daniel P. Kirby +1 more | 1989-12-05 |
| 4824009 | Process for braze attachment of electronic package members | Marvin S. Pittler, Paul A. Totta, Norman G. Ainslie, Paul H. Palmateer | 1989-04-25 |
| 4776978 | Method of controlling the sintering of metal particles | Lester W. Herron, Robert W. Nufer | 1988-10-11 |
| 4764341 | Bonding of pure metal films to ceramics | Philip L. Flaitz, Paul H. Palmateer, Srinivasa S. N. Reddy | 1988-08-16 |
| 4671928 | Method of controlling the sintering of metal particles | Lester W. Herron, Robert W. Nufer | 1987-06-09 |
| 4627160 | Method for removal of carbonaceous residues from ceramic structures having internal metallurgy | Lester W. Herron, Ananda H. Kumar, Robert W. Nufer | 1986-12-09 |
| 4504340 | Material and process set for fabrication of molecular matrix print head | Rao R. Tummala | 1985-03-12 |