Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557420 | Coupling inductors in an IC device using interconnecting elements with solder caps and resulting devices | Tak M. Mak | 2023-01-17 |
| 9646758 | Method of fabricating integrated circuit (IC) devices | Tak M. Mak | 2017-05-09 |
| 7052968 | Method and system for aligning IC die to package substrate | Swee Peng Lee | 2006-05-30 |
| 7030772 | Inspection for alignment between IC die and package substrate | Swee Peng Lee, Leang Hua Kam, Loo Kean Teoh | 2006-04-18 |
| 6621043 | Laser trim process control | Don Lambert, Valerie Vivares | 2003-09-16 |
| 6591992 | Boat for cleaning ball grid array packages | Raj N. Master, Ong Ot, Chan Cs | 2003-07-15 |
| 6446818 | Boat for cleaning ball grid array packages | Raj N. Master, Ot Ong, C S Chan | 2002-09-10 |
| 6333210 | Process of ensuring detect free placement by solder coating on package pads | Raj N. Master | 2001-12-25 |