Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7052968 | Method and system for aligning IC die to package substrate | Ajit M. Dubey | 2006-05-30 | $15,789,000 |
| 7030772 | Inspection for alignment between IC die and package substrate | Ajit M. Dubey, Leang Hua Kam, Loo Kean Teoh | 2006-04-18 | $11,889,000 |