Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device with gel-type thermal interface material

Semiconductor device with gel-type thermal interface material

US Patent 7678615 · Granted Mar 16, 2010

Estimated economic value: $8,771,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Crackstop structures2025
Chip module structure and method and system for chip module design using chip-pa2024
Crackstop with embedded passive radio frequency noise suppressor and method2023
Chip module with robust in-package interconnects2023
Barrier structure with passage for waveguide in photonic integrated circuit2023
Crackstop structures2023
Photonics chips with an edge coupler and a continuous crackstop2023
Graphic formation via material ablation2017
Articles including bonded metal structures and methods of preparing the same2017
Electronic device with plated electrical contact2017
Performance state boost for multi-core integrated circuit2016
Semiconductor dies with reduced area consumption2016