Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10098259 | Heat dissipation in electronics | Robyn Rebecca Reed McLaughlin, Jeffrey Taylor Stellman, Andrew W. Hill | 2018-10-09 |
| 9205486 | Metal alloy injection molding | Raj N. Master, Michael J. Lane, Seah Sun Too | 2015-12-08 |
| 9027631 | Metal alloy injection molding overflows | Raj N. Master, Michael J. Lane, Seah Sun Too | 2015-05-12 |
| 8991473 | Metal alloy injection molding protrusions | Raj N. Master, Michael J. Lane, Seah Sun Too | 2015-03-31 |
| 8733423 | Metal alloy injection molding protrusions | Raj N. Master, Michael J. Lane, Seah Sun Too | 2014-05-27 |