Issued Patents All Time
Showing 25 most recent of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12361628 | Configurable multiple-die graphics processing unit | Mark Fowler, Michael Mantor, Mark Leather | 2025-07-15 |
| 12298829 | Platform power manager for rack level power and thermal constraints | Indrani Paul, Sriram Sambamurthy, Larry D. Hewitt, Kevin M. Lepak, Adam Neil Calder Clark +6 more | 2025-05-13 |
| 12266585 | Arrangement and thermal management of 3D stacked dies | John Wuu, Patrick J. Shyvers, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson | 2025-04-01 |
| 12073806 | Refreshing displays using on-die cache | Ashish Jain, Dhirendra Partap Singh Rana, Gia Tung Phan, Benjamin Tsien | 2024-08-27 |
| 11960340 | Performance management during power supply voltage droop | Eric J. Chapman, Stephen V. Kosonocky, Kaushik Mazumdar, Vydhyanathan Kalyanasundharam, Eric M. Scott | 2024-04-16 |
| 11841803 | GPU chiplets using high bandwidth crosslinks | Skyler Jonathon Saleh, Milind S. Bhagavat, Rahul Agarwal | 2023-12-12 |
| 11703930 | Platform power manager for rack level power and thermal constraints | Indrani Paul, Sriram Sambamurthy, Larry D. Hewitt, Kevin M. Lepak, Adam Neil Calder Clark +6 more | 2023-07-18 |
| 11462294 | Mission mode Vmin prediction and calibration | Ashish Jain, Sriram Sundaram | 2022-10-04 |
| 11189540 | Arrangement and thermal management of 3D stacked dies | John Wuu, Patrick J. Shyvers, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson | 2021-11-30 |
| 11164807 | Arrangement and thermal management of 3D stacked dies | John Wuu, Patrick J. Shyvers, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson | 2021-11-02 |
| 11073888 | Platform power manager for rack level power and thermal constraints | Indrani Paul, Sriram Sambamurthy, Larry D. Hewitt, Kevin M. Lepak, Adam Neil Calder Clark +6 more | 2021-07-27 |
| 11054883 | Power efficiency optimization in throughput-based workloads | Leonardo Piga, Ivan Matosevic, Indrani Paul | 2021-07-06 |
| 10644826 | Flexibile interfaces using through-silicon via technology | John Wuu, Michael Kevin Ciraula, Russell Schreiber | 2020-05-05 |
| 10452554 | Adaptive resizable cache/LCM for improved power | Ihab Amer, Khaled Mammou, Haibo Liu, Edward A. Harold, Fabio Gulino +4 more | 2019-10-22 |
| 10431517 | Arrangement and thermal management of 3D stacked dies | John Wuu, Patrick J. Shyvers, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson | 2019-10-01 |
| 10303398 | Swizzling in 3D stacked memory | John Wuu, Michael Kevin Ciraula, Russell Schreiber | 2019-05-28 |
| 10060955 | Calibrating power supply voltages using reference measurements from code loop executions | Aaron Joseph Grenat, Robert A. Hershberger, Sriram Sambamurthy, Christopher E. Tressler, Sho-Chien Kang +6 more | 2018-08-28 |
| 9958921 | Power management to change power limits based on device skin temperature | Ashish Jain, Benjamin D. Bates, Ali Akbar Merrikh, Steven F. Liepe, Madhu Saravana Sibi Govindan | 2018-05-01 |
| 9772676 | Adaptive voltage scaling based on stage transitions or ring oscillator revolutions | Stephen V. Kosonocky | 2017-09-26 |
| 9727435 | Method and system of sampling to automatically scale digital power estimates with frequency | Suresh Periyacheri | 2017-08-08 |
| 9710034 | Using temperature margin to balance performance with power allocation | Michael J. Osborn, Sebastien Nussbaum | 2017-07-18 |
| 9671767 | Hybrid system and method for determining performance levels based on thermal conditions within a processor | Benjamin D. Bates, Praveen K. Dongara | 2017-06-06 |
| 9575553 | Replica path timing adjustment and normalization for adaptive voltage and frequency scaling | Seng Oon Toh, Edward J. McLellan, Stephen V. Kosonocky, Michael L. Golden | 2017-02-21 |
| 9483092 | Performance state boost for multi-core integrated circuit | Baomin Liu, Maxat Touzelbaev | 2016-11-01 |
| 9319037 | Self-adjusting clock doubler and integrated circuit clock distribution system using same | Arun Sundaresan Iyer, Alok Baluni, Sriram Sambamurthy | 2016-04-19 |