Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Arrangement and thermal management of 3D stacked dies

Arrangement and thermal management of 3D stacked dies

US Patent 11164807 · Granted Nov 2, 2021

Estimated economic value: $465,528,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dynamic setup and hold times adjustment for memories2025
Semiconductor chip device2025
Devices and systems for flying bitline with jumper cell2025
Deterministic mixed latency cache2025
Molded semiconductor chip package with stair-step molding layer2025
Electronic device including dies and an interconnect coupled to the dies and pro2025
Configurable multiple-die graphics processing unit2025
System and method for SEU detection and correction2025
Method and apparatus for increasing memory level parallelism by reducing miss st2025
Platform power manager for rack level power and thermal constraints2025
Fanout module integrating a photonic integrated circuit2025
Semiconductor package with annular package lid structure2025