Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12266585 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Patrick J. Shyvers, Milind S. Bhagavat, Brett P. Wilkerson | 2025-04-01 | |
| 11189540 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Patrick J. Shyvers, Milind S. Bhagavat, Brett P. Wilkerson | 2021-11-30 | $383,963,000 |
| 11164807 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Patrick J. Shyvers, Milind S. Bhagavat, Brett P. Wilkerson | 2021-11-02 | $465,528,000 |
| 10431517 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Patrick J. Shyvers, Milind S. Bhagavat, Brett P. Wilkerson | 2019-10-01 | $27,042,000 |