Issued Patents All Time
Showing 26–50 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7906424 | Conductor bump method and apparatus | Roden R. Topacio, Yip Seng Low, Andrew KW Leung | 2011-03-15 |
| 7799608 | Die stacking apparatus and method | Vincent Chan, Kevin O'Neil | 2010-09-21 |
| 7732914 | Cavity-type integrated circuit package | Katherine Wagenhoffer, Geraldine Tsui Yee Lin, Mohan Kirloskar | 2010-06-08 |
| 7595225 | Leadless plastic chip carrier with contact standoff | Chun Ho Fan, Kin Pul Kwan, Hoi Chi Wong | 2009-09-29 |
| 7411289 | Integrated circuit package with partially exposed contact pads and process for fabricating the same | Geraldine Tsui Yee Lin, Chun Ho Fan, Mohan Kirloskar, Ed A. Varga | 2008-08-12 |
| 7371610 | Process for fabricating an integrated circuit package with reduced mold warping | Chun Ho Fan, Mohan Kirloskar | 2008-05-13 |
| 7372151 | Ball grid array package and process for manufacturing same | Chun Ho Fan, Kwok Cheung Tsang | 2008-05-13 |
| 7358119 | Thin array plastic package without die attach pad and process for fabricating the same | Serafin P. Pedron, Jr., Leo M. Higgins, III, Kwok Cheung Tsang, Kin Pui Kwan | 2008-04-15 |
| 7342305 | Thermally enhanced cavity-down integrated circuit package | Qizhong Diao, Mohan Kirloskar | 2008-03-11 |
| 7315080 | Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader | Chun Ho Fan, Wing Keung Lam, Ming Wang Sze, Sadak Thamby Labeeb, Mohan Kirloskar | 2008-01-01 |
| 7270867 | Leadless plastic chip carrier | Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan | 2007-09-18 |
| 7271032 | Leadless plastic chip carrier with etch back pad singulation | Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2007-09-18 |
| 7247526 | Process for fabricating an integrated circuit package | Chun Ho Fan, Wing Him Lau, Emily Shui Ming Tse | 2007-07-24 |
| 7232755 | Process for fabricating pad frame and integrated circuit package | Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan | 2007-06-19 |
| 7226811 | Process for fabricating a leadless plastic chip carrier | Chun Ho Fan, Kin Pui Kwan, Wing Him Lau | 2007-06-05 |
| 7224048 | Flip chip ball grid array package | Tak Sang Yeung | 2007-05-29 |
| 7091581 | Integrated circuit package and process for fabricating the same | Geraldine Tsui Yee Lin, Chun Ho Fan, Mohan Kirloskar, Ed A. Varga | 2006-08-15 |
| 6995460 | Leadless plastic chip carrier with etch back pad singulation | Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2006-02-07 |
| 6989294 | Leadless plastic chip carrier with etch back pad singulation | Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2006-01-24 |
| 6987032 | Ball grid array package and process for manufacturing same | Chun Ho Fan, Wing Keung Lam, Ming Wang Sze, Sadak Thamby Labeeb, Mohan Kirloskar | 2006-01-17 |
| 6984785 | Thermally enhanced cavity-down integrated circuit package | Qizhong Diao, Mohan Kirloskar | 2006-01-10 |
| 6946324 | Process for fabricating a leadless plastic chip carrier | Chun Ho Fan, Kin Pui Kwan, Wing Him Lau | 2005-09-20 |
| 6940154 | Integrated circuit package and method of manufacturing the integrated circuit package | Serafin P. Pedron, Jr., Lin Yee | 2005-09-06 |
| 6933176 | Ball grid array package and process for manufacturing same | Mohan Kirloskar, Chun Ho Fan | 2005-08-23 |
| 6933594 | Leadless plastic chip carrier with etch back pad singulation | Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2005-08-23 |