Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847383 | Integrated circuit package strip with stiffener | Neil McLellan, Roden R. Topacio | 2014-09-30 |
| 8637391 | Flip chip semiconductor assembly with variable volume solder bumps | — | 2014-01-28 |
| 8378471 | Semiconductor chip bump connection apparatus and method | Roden R. Topacio, Fan Yeung | 2013-02-19 |
| 8120170 | Integrated package circuit with stiffener | Neil McLellan, Roden R. Topacio | 2012-02-21 |
| 7985621 | Method and apparatus for making semiconductor packages | Neil McLellan, Roden R. Topacio | 2011-07-26 |
| 7969020 | Die stacking apparatus and method | Neil McLellan, Kevin O'Neil | 2011-06-28 |
| 7914648 | Device for web control having a plurality of surface features | Young Ho Chung, Hasan Eroglu | 2011-03-29 |
| 7799608 | Die stacking apparatus and method | Neil McLellan, Kevin O'Neil | 2010-09-21 |
| 7670939 | Semiconductor chip bump connection apparatus and method | Roden R. Topacio, Fan Yeung | 2010-03-02 |
| 7432825 | Interrogation device and method for scanning | Ezequiel Mejia | 2008-10-07 |
| 7215022 | Multi-die module | Samuel Ho | 2007-05-08 |
| 7015826 | Method and apparatus for sensing and transmitting a body characteristic of a host | Ezequiel Mejia | 2006-03-21 |
| 6929976 | Multi-die module and method thereof | Samuel Ho | 2005-08-16 |
| 6849940 | Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same | Samuel Ho | 2005-02-01 |
| 6798667 | Solder ball collapse control apparatus and method thereof | — | 2004-09-28 |
| 4190792 | Positioning control system | — | 1980-02-26 |