Vincent Chan — 16 Patents at AMD

Vincent Chan has been granted 16 US patents while listed as an inventor at AMD. The first was granted in 1980 and the most recent in September 2014. Vincent Chan ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Vincent Chan in Taipei, ON, TW.

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8847383	Integrated circuit package strip with stiffener	Neil McLellan, Roden R. Topacio	2014-09-30
8637391	Flip chip semiconductor assembly with variable volume solder bumps	—	2014-01-28
8378471	Semiconductor chip bump connection apparatus and method	Roden R. Topacio, Fan Yeung	2013-02-19
8120170	Integrated package circuit with stiffener	Neil McLellan, Roden R. Topacio	2012-02-21
7985621	Method and apparatus for making semiconductor packages	Neil McLellan, Roden R. Topacio	2011-07-26
7969020	Die stacking apparatus and method	Neil McLellan, Kevin O'Neil	2011-06-28	$11,920,000
7914648	Device for web control having a plurality of surface features	Young Ho Chung, Hasan Eroglu	2011-03-29	$208,978,000
7799608	Die stacking apparatus and method	Neil McLellan, Kevin O'Neil	2010-09-21	$7,003,000
7670939	Semiconductor chip bump connection apparatus and method	Roden R. Topacio, Fan Yeung	2010-03-02
7432825	Interrogation device and method for scanning	Ezequiel Mejia	2008-10-07
7215022	Multi-die module	Samuel Ho	2007-05-08
7015826	Method and apparatus for sensing and transmitting a body characteristic of a host	Ezequiel Mejia	2006-03-21	$2,708,000
6929976	Multi-die module and method thereof	Samuel Ho	2005-08-16	$23,098,000
6849940	Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same	Samuel Ho	2005-02-01	$17,331,000
6798667	Solder ball collapse control apparatus and method thereof	—	2004-09-28	$31,925,000
4190792	Positioning control system	—	1980-02-26

Vincent Chan — 16 Patents

Issued Patents All Time

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