Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for making semiconductor packages

Method and apparatus for making semiconductor packages

US Patent 7985621 · Granted Jul 26, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device including a substrate, a structure, and an adhesive and a proc2024
Semiconductor package assembly using a passive device as a standoff2024
Semiconductor chip with patterned underbump metallization and polymer film2022
Integrated circuit product customizations for identification code visibility2022
Circuit board with constrained solder interconnect pads2019
Interconnect etch with polymer layer edge protection2019
Circuit board with corner hollows2018
Circuit board with via trace connection and method of making the same2017
Interconnect etch with polymer layer edge protection2017
Semiconductor chip package with undermount passive devices2017
Semiconductor chip with patterned underbump metallization and polymer film2017
Method of fabricating an integrated circuit (IC) package having a plurality of s2016