Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8779598 | Method and apparatuses for integrated circuit substrate manufacture | Raymond Tsang, Edward Law | 2014-07-15 |
| 8378471 | Semiconductor chip bump connection apparatus and method | Roden R. Topacio, Vincent Chan | 2013-02-19 |
| 7670939 | Semiconductor chip bump connection apparatus and method | Roden R. Topacio, Vincent Chan | 2010-03-02 |
| 7646083 | I/O connection scheme for QFN leadframe and package structures | Sam Ziqun Zhao, Nir Matalon, Victor Fong | 2010-01-12 |