Issued Patents All Time
Showing 51–75 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6903304 | Process for dressing molded array package saw blade | Chun Ho Fan, Geraldine Tsui Yee Lin, John Ping Sheung Lau | 2005-06-07 |
| 6872661 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan | 2005-03-29 |
| 6841859 | Premolded cavity IC package | Labeeb Sadak Thamby, Hugo Chi Wai Wong, William Lap Keung Chow | 2005-01-11 |
| 6821817 | Premolded cavity IC package | Labeeb Sadak Thamby, Hugo Chi Wai Wong, William Lap Keung Chow | 2004-11-23 |
| 6790710 | Method of manufacturing an integrated circuit package | Chun Ho Fan, Edward Combs, Tsang Cheung, Chow Keung, Sadak Thamby Labeeb | 2004-09-14 |
| 6737755 | Ball grid array package with improved thermal characteristics | Ming Wang Sze, Wing Keung Lam, Kin-wai Wong | 2004-05-18 |
| 6667191 | Chip scale integrated circuit package | Wing Him Lau, Tak Sang Yeung, Onofre A. Rulloda, Jr. | 2003-12-23 |
| 6635957 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan | 2003-10-21 |
| 6585905 | Leadless plastic chip carrier with partial etch die attach pad | Chun Ho Fan, Tsui Yee Lin, Kin Yan Tsang | 2003-07-01 |
| 6498099 | Leadless plastic chip carrier with etch back pad singulation | Nelson Fan | 2002-12-24 |
| 6429048 | Metal foil laminated IC package | Chun Ho Fan, Kwok Cheung Tsang, Pik Ling Lau | 2002-08-06 |
| 6294100 | Exposed die leadless plastic chip carrier | Nelson Fan | 2001-09-25 |
| 6242281 | Saw-singulated leadless plastic chip carrier | Nelson Fan | 2001-06-05 |
| 6229200 | Saw-singulated leadless plastic chip carrier | Nelson Fan | 2001-05-08 |
| 6020634 | Replaceable power module | Mark A. Gerber, Michael Strittmatter, Joseph P. Hundt | 2000-02-01 |
| 6021046 | Thermal protection of electrical elements systems | Mike Strittmatter | 2000-02-01 |
| 5913552 | Method of providing thermal protection of electrical elements | Mike Strittmatter | 1999-06-22 |
| 5892304 | Power cap | Mark A. Gerber, Michael Strittmatter, Joseph P. Hundt | 1999-04-06 |
| 5821619 | Replaceable power module | Mark A. Gerber, Michael Strittmatter, Joseph P. Hundt | 1998-10-13 |
| 5682068 | Power cap | Mark A. Gerber, Michael Strittmatter, Joseph P. Hundt | 1997-10-28 |
| D384336 | Power cap cover | Mark A. Gerber, Michael Strittmatter | 1997-09-30 |
| 5647121 | Method of assembling electronic component | Mike Strittmatter, Joseph P. Hundt, Christopher M. Sells, Francis A. Scherpenberg | 1997-07-15 |
| 5579206 | Enhanced low profile sockets and module systems | Mike Strittmatter, Joseph P. Hundt, Christopher M. Sells, Francis A. Scherpenberg | 1996-11-26 |
| 5528463 | Low profile sockets and modules for surface mountable applications | Mike Strittmatter, Joseph P. Hundt, Christopher M. Sells, Francis A. Scherpenberg | 1996-06-18 |
| 5130783 | Flexible film semiconductor package | — | 1992-07-14 |